Cooling mechanism of high mounting flexibility

ABSTRACT

A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of co-pending application Ser. No.14/675,059 filed on Mar. 31, 2015 for which priority is claimed under 35U.S.C. §120, the entire contents of which are hereby incorporated byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to hard disk drive technology and moreparticularly, to a cooling mechanism of high mounting flexibility, whichprovides a margin between each heat pipe and each respectiveposition-limit sliding groove that accommodates the respective heat pipefor enabling the hot interfaces of multiple heat pipes to be positionedin one heat transfer block in reversed directions so that the coldinterfaces of the heat pipes can be extended to different peripheralsides of the heat sink to enhance the overall heat dissipationefficiency.

2. Description of the Related Art

Following fast development of technology, advanced computers, notebooksand many other electronic products have been continuously created andwidely used in every corner of the society. It is the market trend tocreate electronic products having the characteristics of strongcomputing capabilities, high operating speed and small size. However,increasing the operating speed of a computer or notebook will lead to anincrease in the amount of latent heat produced by the CPU, imagingprocessor or other active component parts of the motherboard. It isquite important to keep the temperature of the component parts withinthe optimal range.

It is the normal way to dissipate heat from heat sources of a circuitboard by directly attaching a heat sink to the heat sources. Heat sinkswith thick cooling fins or different sizes of heat sinks are selectivelyused to mate with different heat sources having different heights.However, thick cooling fins have a relatively higher thermal resistance.Taking into consideration the characteristics of low thermal resistance,it needs to use different sizes of heat sinks to mate with differentheat sources.

This heat transfer medium can be used in a heat sink to reduce thermalresistance. However, the thickness of the applied heat transfer mediumaffects the thermal resistance. Cooling modules are then developed toeffectively reduce the thermal resistance by means of reducing thethickness of heat transfer medium. A conventional cooling module A, asshown in FIG. 10, comprises a heat sink base A1 which defines aplurality of openings A12, a plurality of locating grooves A11respectively extended from the openings A12 and a plurality of mountingholes A13 respectively disposed at two opposite sides relative to eachopening A12, a plurality of heat pipes A2 respectively accommodated inthe locating grooves A11, each heat pipe A2 having one end A21 thereofbonded to one end of one respective locating groove A11 and an oppositeend thereof extended to one respective opening A12, a plurality of metalblocks A3 fastened to the heat sink base A1 over the openings A12 andrespectively abutted against the respective heat pipes A2, and aplurality of spring members A33 stopped between the heat sink base A1and the metal blocks A3. Each metal block A3 comprises a plurality ofmounting through holes A31, and a plurality of screws A32 respectivelyinserted through the mounting through holes A31 and the spring membersA33 and fastened to the respective mounting holes A13 heat sink base A1.Thus, the metal blocks A3 are flexibly supported on the spring membersA33 for abutting against respective heat sources in a circuit board ofan electronic apparatus to transfer latent heat from the heat sources tothe heat pipes A2 for quick dissipation. Subject to the functioning ofthe spring members A33, the metal blocks A3 can be kept in tight contactwith the respective heat sources, reducing the thermal resistance.However, the arrangement of the spring members A33 between the metalblocks A3 and the heat sink base A1 affects the heat transfer efficiencyof transferring latent heat from the heat sources to the heat sink baseA1. In this design, the spring members A33 are respectively stopped atthe four corners of the metal blocks A3 to keep the metal blocks A3 inbalance. However, because each heat pipe A2 has one end A21 thereofbonded to one end of one respective locating groove A11 and an oppositeend thereof extended to one respective opening A12, thus, the oppositeends of the heat pipes A2 can simply be arranged in one direction in aparallel manner and bonded to the respective metal blocks A3, i.e., theheat pipes A2 cannot be symmetrically arranged at two opposite sidesrelative to the metal blocks A3 to let the opposite ends thereof beextended to all different peripheral sides of the heat sink base A1,restricting the use of space and limiting the cooling performance. Animprovement in this regard is desired.

SUMMARY OF THE INVENTION

The present invention has been accomplished under the circumstances inview. It is therefore one object of the present invention to provide acooling mechanism of high mounting flexibility, which comprises a heatsink, at least one heat transfer block and at least one elastic membermounted in the heat sink, and a plurality of heat pipes mounted in theheat sink and set between the at least one heat transfer block and theat least one elastic member. The heat sink comprises a heat sink body,which comprises at least one accommodation portion and a plurality ofposition-limit sliding grooves extended from the at least oneaccommodation portion for accommodating the heat pipes respectively, anda plurality of stop blocks fastened to the heat sink body to stop theheat pipes in the position-limit sliding grooves. Each heat pipecomprises a hot interface located at one end thereof and accommodated inone accommodation portion, and a cold interface located at an oppositeend thereof and positioned in one position-limit sliding groove. The atleast one heat transfer block is mounted in the at least oneaccommodation portion of the heat sink body, each comprising a recessedinsertion passage located in one side thereof for accommodating the hotinterface of at least one heat pipe and a planar contact surface locatedat an opposite side thereof for the contact of a heat source of anexternal circuit board. The at least one elastic member is elasticallypositioned between the heat sink and the at least one heat transferblock. Further, the width of the position-limit sliding grooves islarger than the outer diameter of the heat pipes. The margin leftbetween the position-limit sliding grooves and the heat pipes allowsadjustment of the position of the heat pipes in the respectiveposition-limit sliding grooves in the horizontal direction. Theaforesaid structural design allows the hot interfaces of the heat pipesto be arranged in the recessed insertion passages of the heat transferblocks in a parallel manner and the cold interfaces of the heat pipes tobe extended out of the heat transfer blocks to different peripheralsides of the heat sink for quick dissipation of heat.

Preferably, the heat sink body of the heat sink further comprises anopening located in the accommodation portion, and a plurality of thefirst screw holes spaced around the opening. Further, each heat transferblock comprises a positioning structure. The positioning structurecomprises a plurality of second screw holes spaced around the recessedinsertion passage thereof. Further, each elastic member comprises atleast one elastic mounting lug. Each elastic mounting lug comprises anelongated position-limit slot located in one end thereof and fastened toone respective first screw hole of the heat sink body by a respectivescrew, and a circular first through hole located in an opposite holethereof and fastened to one second screw hole of the positioningstructure of one heat transfer block. Thus, the heat transfer blocks canbe elastically and positively kept in contact with the external heatsources, effectively reducing thermal resistance.

Preferably, each elastic member comprises an abutment shrapnel. Theabutment shrapnel comprises a plurality of elastic protruding portionsabutted against the heat pipes, and a plurality of circular secondthrough holes spaced around the elastic protruding portions andrespectively fastened to one respective second screw hole of the atleast one heat transfer block by a respective screw. By means ofadjusting the threaded depth of the screws in the respective secondscrew holes, the pressure of the elastic protruding portions being actedon the heat pipes is relatively adjusted, keeping the heat pipes and theheat transfer blocks in a tight contact relationship, and thus, thecooling mechanism of high mounting flexibility is well assembled.

Preferably, the heat sink body of the heat sink comprises a plurality ofrecessed positioning grooves located in the accommodation portion. Theat least one elastic member comprises a plurality of elastic thermalpads respectively positioned in the recessed positioning grooves of theheat sink to abut against the at least one heat transfer block. Further,metal sheets are respectively set in between a plurality of the heattransfer blocks and the elastic thermal pads and fixedly fastened to therespective heat transfer blocks for quick transfer of heat. Thus, thelatent heat produced during the operation of the heat sources can berapidly transferred through the heat transfer blocks to the heat pipesand through the metal sheets and the elastic thermal pads to the heatsink to enhance the heat dissipation efficiency.

Other advantages and features of the present invention will be fullyunderstood by reference to the following specification in conjunctionwith the accompanying drawings, in which like reference signs denotelike components of structure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an oblique top elevational view of a cooling mechanism of highmounting flexibility in accordance with the present invention.

FIG. 2 is an exploded view of the cooling mechanism of high mountingflexibility in accordance with the present invention.

FIG. 3 corresponds to FIG. 2 when viewed in another angle.

FIG. 4 is a sectional side view of the cooling mechanism of highmounting flexibility in accordance with the present invention.

FIG. 5 is an oblique top elevational view of an alternate form of thecooling mechanism of high mounting flexibility in accordance with thepresent invention.

FIG. 6 is an exploded view of the alternate form of the coolingmechanism of high mounting flexibility in accordance with the presentinvention.

FIG. 7 is a sectional front view of the alternate form of the coolingmechanism of high mounting flexibility in accordance with the presentinvention.

FIG. 8 is a sectional side view of the alternate form of the coolingmechanism of high mounting flexibility in accordance with the presentinvention.

FIG. 9 is a sectional front view of another alternate form of thecooling mechanism of high mounting flexibility in accordance with thepresent invention.

FIG. 10 is an oblique top elevational view of a cooling module accordingto the prior art.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to FIGS. 1-4, a cooling mechanism of high mounting flexibilityin accordance with the present invention is shown. The cooling mechanismof high mounting flexibility comprises a heat sink 1, a plurality ofheat pipes 2, at least one heat transfer block 3, and at least oneelastic member 4.

The heat sink 1 comprises a heat sink body 11, and a plurality of stopblocks 14. The heat sink body 11 comprises an accommodation portion 12defined in a top side thereof, an opening 121 located in theaccommodation portion 12, a plurality of first screw holes 111 sparedaround the opening 121, a plurality of position-limit sliding grooves 13outwardly extended from the accommodation portion 12 to the border areathereof for accommodating the heat pipes 2, a plurality of mountingthrough holes 131 spaced around each position-limit sliding groove 13,and a plurality of internally threaded columns 15 spaced around theposition-limit sliding grooves 13. The stop blocks 14 are mounted on theheat sink body 11 and adapted to stop the heat pipes 2 in theposition-limit sliding grooves 13. The stop blocks 14 are preferablymade in the form of a cooling block, each comprising a plurality ofthrough holes 141 and a screw 142 mounted in each through hole 141.

The heat pipes 2 in this embodiment are flat pipes to achieve alow-profile design, each having a hot interface 21 for absorbing heatand an opposing cold interface 22 for discharging heat. In actualapplication, the shape of the heat pipes 2 can be changed to mate withthe structural design of the heat sink 1.

Each heat transfer block 3 comprises at least one, for example, onerecessed insertion passage 31 located in a bottom side thereof andhaving two opposite open ends thereof disposed in a dislocated manner, apositioning structure 32 comprising a plurality of second screw holes321 spaced around the recessed insertion passage 31 and at least onenotch 322 respectively disposed adjacent to one respective second screwhole 321, and a planar contact surface 33 located on an opposing topside thereof.

Each elastic member 4 comprises at least one elastic mounting lug 41 andan abutment shrapnel 42. Each elastic mounting lug 41 comprises anelongated position-limit slot 411 located in one end thereof, a circularfirst through hole 412 located in an opposite end thereof, and twoscrews 413 respectively inserted through the elongated position-limitslot 411 and the circular first through hole 412 in reversed directions.The abutment shrapnel 42 comprises a plurality of elastic protrudingportion 421, a plurality of circular second through holes 422 spacedaround the elastic protruding portions 421, and a screw 423 mounted ineach circular second through hole 422.

When assembling the cooling mechanism of high mounting flexibility, putthe heat pipes 2 in the respective position-limit sliding grooves 13 inthe heat sink body 11 of the heat sink 1 to suspend the hot interfaces21 of the heat pipes 2 in the opening 121 in the accommodation portion12 and to keep the respective cold interfaces 22 in the respectiveposition-limit sliding grooves 13, and then place the stop blocks 14 onthe heat sink body 11 around the position-limit sliding grooves 13 overthe heat pipes 2, and then thread the screws 142 in the through holes141 into the respective mounting through holes 131 around theposition-limit sliding grooves 13 to affix the stop blocks 14 to theheat sink body 11, holding the heat pipes 2 in the respectiveposition-limit sliding grooves 13. Further, the width of theposition-limit sliding grooves 13 is larger than the outer diameter ofthe heat pipes 2, providing a margin.

Thereafter, aim the elongated position-limit slots 411 of the elasticmounting lugs 41 of the elastic member 4 at the respective first screwholes 111 of the heat sink body 11, and then thread the respectivescrews 413 in the elongated position-limit slots 411 into the respectivefirst screw holes 111, and then insert the heat transfer block 3 in theopening 121 in the accommodation portion 12 to abut the recessedinsertion passage 31 against the hot interfaces 21 of the heat pipes 2and insert the elastic mounting lug 41 into the notch 322 of thepositioning structure 32 and then thread the screw 413 in the circularfirst through hole 412 into one respective second screw hole 321 of thepositioning structure 32 to affix the elastic mounting lug 41 to theheat transfer block 3, and then insert the abutment shrapnel 42 of theelastic member 4 into the opening 121 in the accommodation portion 12 ofthe heat sink body 11 to abut the elastic protruding portions 421 of theabutment shrapnel 42 against the heat pipes 2, and then thread thescrews 423 in the respective circular second through holes 422 intorespective second screw holes 321 of the positioning structure 32. Thus,the heat transfer block 3, the elastic member 4 and the heat sink body11 are fixedly fastened together, securing the hot interfaces 21 of theheat pipes 2 in the recessed insertion passage 31 between the abutmentshrapnel 42 and the heat transfer block 3. By means of adjusting thethreaded depth of the screws 423 in the respective second screw holes321, the pressure of the elastic protruding portions 421 being acted onthe heat pipes 2 is relatively adjusted, keeping the heat pipes 2 andthe heat transfer blocks 3 in a tight contact relationship, and thus,the cooling mechanism of high mounting flexibility is well assembled.

The heat sink 1 can be made from aluminum or copper. Further, the heatpipes 2 can be kept in direct contact with the surfaces of theposition-limit sliding grooves 13 of the heat sink 1, or, a thermalpaste can be applied to the surface area between the heat pipes 2 andthe position-limit sliding grooves 13 of the heat sink 1. Further, theheat transfer block 3 is preferably made from copper. A thermal pastecan be applied to the surface area between the recessed insertionpassage 31 of the heat transfer block 3 and the heat pipe 2 to fill upthe designed-in clearance between the heat pipes 2 and the heat sink 1or heat transfer block 3 and the gaps in rough, uneven surfaces.

The cooling mechanism of high mounting flexibility can be used todissipate heat from each heat source such as CPU, GMCH (Graphics andMemory Controller Hub) chip, ICH (I/O Controller Hub) chip or RAM(Random Access Memory) chip in a circuit board (such as motherboard,interface card) of a computer, notebook, server, embedded system orother computer equipment. In application, attach the planar contactsurface 33 of each heat transfer block 3 to one respective heat sourcein the circuit board, and then mount screws in the circuit board andthread these screws into the respective internally threaded columns 15of the heat sink 1 to affix the cooling mechanism of high mountingflexibility to the circuit board of the computer, notebook, server,embedded system or other computer equipment. Further, in installation, athermal paste can be applied to the surface area between the planarcontact surface 33 of each heat transfer block 3 and each respectiveheat source in the circuit board of the computer, notebook, server,embedded system or other computer equipment.

When abutting each heat transfer block 3 against one respective heatsource of the circuit board of the computer, notebook, server, embeddedsystem or other computer equipment, each heat transfer block 3 is forcedto move vertically in direction toward the inner side of theaccommodation portion 12 of the heat sink 1 to impart a pressure to thehot interface 21 of the respective heat pipe 2. Subject to thearrangement of the stop blocks 14 to stop the cold interfaces 22 of theheat pipes 2 in the respective position-limit sliding grooves 13, andthe positioning of the screw 413 in the elongated position-limit slots411 of the elastic mounting lugs 41 of the elastic member 4 and thefirst screw hole 111 of heat sink 1 to support the heat transfer blocks3, the heat transfer blocks 3 can be automatically flexibly adjusted tokeep in positive contact with the respective heat sources of the circuitboard of the computer, notebook, server, embedded system or othercomputer equipment, effectively reducing thermal resistance. The marginleft between the position-limit sliding grooves 13 and the heat pipes 2allows adjustment of the position of the heat pipes 2 in the respectiveposition-limit sliding groove 13 in the horizontal direction. Theaforesaid structural design allows the hot interfaces 21 of the heatpipes 2 to be arranged in the recessed insertion passages 31 of the heattransfer blocks 3 in a parallel manner and the cold interfaces 22 of theheat pipes 2 to be extended out of the heat transfer blocks 3 todifferent peripheral sides of the heat sink 1. When the heat transferblocks 3 are respectively abutted against the respective heat sources ofthe circuit board of the computer, notebook, server, embedded system orother computer equipment, the heat pipes 2 can be moved in therespective position-limit sliding grooves 13, keeping the respectiveheat transfer blocks 3 in positive contact with the respective heatsources of the circuit board of the computer, notebook, server, embeddedsystem or other computer equipment, and thus, the invention effectivelyreduces the thermal resistance and enhances the overall heat dissipationefficiency.

During operation of each source of the circuit board of the computer,notebook, server, embedded system, or other computer equipment, eachrespective aluminum or copper heat transfer block 3 absorbs latent heatfrom the respective heat source and transfers absorbed latent heat tothe hot interface 21 of the respective heat pipe 2 directly or throughthe applied thermal paste, enabling the internal working fluid of eachheat pipe 2 to repeatedly cycle phase transition between the hotinterface 21 and cold interface 22 thereof through a capillary action orgravity. Further, the stop blocks 14 (for example, cooling blocks) andthe aluminum or copper heat sink 1 provide a large area of heatdissipation surface to facilitate rapid and efficient dissipation oflatent heat from each heat source of the circuit board of the computer,notebook, server, embedded system or other computer equipment,maintaining normal system functioning.

Referring to FIGS. 5-8, in an alternate form of the present invention,at least one recessed positioning groove 122 is defined in theaccommodation portion 12 of the heat sink 1 to substitute for theaforesaid at least one opening 121. In this alternate form, the heatsink 1 further comprises a plurality of locating grooves 132respectively extended from the position-limit sliding grooves 13 overthe mounting through holes 131; the stop blocks 14 are cooling finsrespectively fitted into the locating grooves 132 and kept in flush withthe surface of the heat sink 1; the screws 142 in the through holes 141of the cooling fins 14 are respectively threaded into the respectivemounting through holes 131 to affix the respective cooling fins 14 tothe heat sink 1 in a flush manner, achieving a low profile design.

Further, in this alternate form of the present invention, at least oneheat transfer medium 331 (such as cooling fin or thermal paste) ismounted on the planar contact surface 33 of each heat transfer block 3to effectively reduce the thermal resistance between each heat source ofthe circuit board of the computer, notebook, server, embedded system orother computer equipment and each respective heat transfer block 3; theelastic members 4 are made in the form of an elastic thermal pad 43without the aforesaid elastic mounting lug 41 or abutment shrapnel 42,and respectively positioned in the recessed positioning groove 122 ofthe heat sink 1 to abut against the heat transfer blocks 3. Further,these elastic thermal pads 43 can be silicone, rubber or ceramic-basedelastic members adapted to fill up the designed-in clearance between theheat sink 1 and the heat transfer blocks 3 and the gaps in rough, unevensurfaces. When the heat transfer blocks 3 are abutted against respectiveheat sources of the circuit board of the computer, notebook, server,embedded system, or other computer equipment, the elastic thermal pads43 provides an elastic supporting force to the heat transfer blocks 3against the heat sources of the circuit board of the computer, notebook,server, embedded system or other computer equipment, keeping the heattransfer blocks 3 in close contact with the respective heat sources andminimizing the thermal resistance therebetween, and thus, the overallheat dissipation performance of the cooling mechanism of high mountingflexibility is greatly enhanced.

Further, in another alternate form of the present invention, as shown inFIG. 9, metal sheets 34, for example, aluminum or copper sheet, arerespectively set in between the heat transfer blocks 3 and the elasticthermal pads 43 of the elastic members 4, and fixedly fastened to thesurface of the respective heat transfer blocks 3 by welding, screw,rivet or thermal adhesive, holding down the hot interfaces 21 of theheat pipes 2 in the recessed insertion passages 31 of the heat transferblocks 3. Further, a thermal paste can be applied to the surface areabetween the metal sheets 34 and the heat pipes 2. By means of directcontact between the elastic thermal pads 43 and the metal sheet 34 andbetween the metal sheets 34 and the heat pipes 2, latent heat can berapidly transferred from the heat sources of the circuit board of thecomputer, notebook, server, embedded system or other computer equipmentthrough the heat transfer blocks 3 to the hot interfaces 21 of the heatpipes 2 and through the metal sheets 34 and the elastic thermal pads 43to the heat sink 1 for quick dissipation.

In conclusion, the invention provides a cooling mechanism of highmounting flexibility, which comprises a heat sink 1, at least one heattransfer block 3 and at least one elastic member 4 mounted in the heatsink 1, and a plurality of heat pipes 2 mounted in the heat sink 1 andset between the at least one heat transfer block 3 and the at least oneelastic member 4, wherein the heat sink 1 comprises an accommodationportion 12 defined in the heat sink body 11 thereof, a plurality ofposition-limit sliding grooves 13 located in the heat sink body 11 andoutwardly extended from the accommodation portion 12 for accommodatingthe heat pipes 2, and a plurality of stop blocks 14 fastened to the heatsink body 11 to stop the heat pipes 2 in the position-limit slidinggroove 13; each heat pipe 2 has a hot interface 21 accommodated in theaccommodation portion 12 within a recessed insertion passage 31 of theheat transfer block 3, and an opposing cold interface 22 extended to aborder area of the heat sink body 11; each elastic member 4 is setbetween the heat sink 1 and one respective heat transfer block 3 to holdthe respective heat pins 2 therebetween; the width of the position-limitsliding grooves 13 is larger than the outer diameter of the heat pipes 2to provide a margin that allows adjustment of the position of the heatpipes 2 in the respective position-limit sliding groove 13 in thehorizontal direction. The aforesaid structural design allows the hotinterfaces 21 of the heat pipes 2 to be reversely arranged in therecessed insertion passages 31 of the heat transfer blocks 3 in aparallel manner and the cold interfaces 22 of the heat pipes 2 to beextended out of the heat transfer blocks 3 to different peripheral sidesof the heat sink 1 to enhance the heat dissipation efficiency.

Although particular embodiments of the invention have been described indetail for purposes of illustration, various modifications andenhancements may be made without departing from the spirit and scope ofthe invention. Accordingly, the invention is not to be limited except asby the appended claims.

What the invention claimed is:
 1. A cooling mechanism of high mountingflexibility, comprising a heat sink, at least one heat transfer blockand at least one elastic member mounted in said heat sink, and aplurality of heat pipes mounted in said heat sink and set between saidat least one heat transfer block and said at least one elastic member,wherein: said heat sink comprises a heat sink body, said heat sink bodycomprising at least one accommodation portion and a plurality ofposition-limit sliding grooves extended from said at least oneaccommodation portion for accommodating said heat pipes respectively,and a plurality of stop blocks fastened to said heat sink body to stopsaid heat pipes in said position-limit sliding grooves; each said heatpipe comprises a hot interface located at one end thereof andaccommodated in one said accommodation portion, and a cold interfacelocated at an opposite end thereof and positioned in one saidposition-limit sliding groove; said at least one heat transfer block ismounted in said at least one accommodation portion of said heat sinkbody, each said heat transfer block comprising a recessed insertionpassage located in one side thereof for accommodating the hot interfaceof at least one said heat pipe and a planar contact surface located atan opposite side thereof for the contact of a heat source of an externalcircuit board; said at least one elastic member is elasticallypositioned between said heat sink and said at least one heat transferblock.
 2. The cooling mechanism of high mounting flexibility as claimedin claim 1, wherein said heat sink body of said heat sink furthercomprises at least one first screw hole disposed near said accommodationportion; each said heat transfer block comprises a positioningstructure, said positioning structure comprising a plurality of secondscrew holes spaced around the recessed insertion passage thereof; eachsaid elastic member comprises at least one elastic mounting lug, eachsaid elastic mounting lug comprising an elongated position-limit slotlocated in one end thereof and fastened to one respective said firstscrew hole of said heat sink body by a respective screw and a circularfirst through hole located in an opposite hole thereof and fastened toone said second screw hole of said positioning structure of one saidheat transfer block.
 3. The cooling mechanism of high mountingflexibility as claimed in claim 1, wherein the width of saidposition-limit sliding grooves of said heat sink is larger than theouter diameter of said heat pipes.
 4. The cooling mechanism of highmounting flexibility as claimed in claim 1, wherein said heat sink bodyof said heat sink further comprises a plurality of mounting through holespaced around said position-limit sliding grooves; each said stop blockcomprises a plurality of through holes fastened to respective saidmounting through holes of said heat sink body of said heat sink byrespective screws.
 5. The cooling mechanism of high mounting flexibilityas claimed in claim 4, wherein said heat sink body of said heat sinkfurther comprises a plurality of locating grooves respectively extendedfrom said position-limit sliding grooves; said mounting through holesare located in said locating grooves; said stop blocks are respectivelyfitted into said locating grooves and kept in flush with said heat sinkbody of said heat sink.
 6. The cooling mechanism of high mountingflexibility as claimed in claim 1, wherein said heat sink body of saidheat sink comprises a plurality of recessed positioning grooves locatedin said accommodation portion; said at least one elastic member eachcomprises an elastic thermal pad respectively positioned in saidrecessed positioning grooves of said heat sink to abut against said atleast one heat transfer block.
 7. The cooling mechanism of high mountingflexibility as claimed in claim 1, wherein said heat sink is selectivelymade from aluminum or copper.